Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18098782
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Filing Dt:
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01/19/2023
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Publication #:
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Pub Dt:
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05/18/2023
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Inventors:
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Michael Kelly, In Su Mok, Won Chul Do, Gam Han Yong, Ji Hun Lee, David Hiner et al
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Title:
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SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491 B RIVER VALLEY ROAD |
| VALLEY POINT #12/03 |
| SINGAPORE, SINGAPORE 248373 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STREET |
| CHICAGO, IL 60661 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491B RIVER VALLEY ROAD |
| VALLEY POINT #12/03 |
| SINGAPORE, SINGAPORE 248373 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STREET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100, AMKOR-RO, BUK-GU |
| GWANGJU, KOREA, REPUBLIC OF 61006 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STREET |
| CHICAGO, IL 60661 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2045 EAST INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STREET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
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09/22/2024 05:14 AM
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