Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/26/2023
|
Application #:
|
18156711
|
Filing Dt:
|
01/19/2023
|
|
Publication #:
|
|
Pub Dt:
|
05/25/2023
| | | | |
|
Inventors:
|
Ta-Pen GUO, Li-Chun TIEN, Chien-Ying CHEN, Lee-Chung LU
|
|
Title:
|
METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING DEEP VIAS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, SINGAPORE 300-78 |
|
|
|
|
| HAUPTMAN HAM, LLP |
| 2318 MILL ROAD, SUITE 1400 |
| ALEXANDRIA, VA 22314 |
|
|
Search Results as of:
06/28/2024 04:58 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
