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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/26/2023
Application #:
18156711
Filing Dt:
01/19/2023
Publication #:
Pub Dt:
05/25/2023
Inventors:
Ta-Pen GUO, Li-Chun TIEN, Chien-Ying CHEN, Lee-Chung LU
Title:
METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING DEEP VIAS
Assignment: 1
Reel/Frame:
062424/0603Recorded: 01/19/2023Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/17/2019
Exec Dt:
10/17/2019
Exec Dt:
10/17/2019
Exec Dt:
10/21/2019
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, SINGAPORE 300-78
Correspondent:
HAUPTMAN HAM, LLP
2318 MILL ROAD, SUITE 1400
ALEXANDRIA, VA 22314

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