Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17571901
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Filing Dt:
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01/10/2022
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Publication #:
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Pub Dt:
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05/25/2023
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Inventors:
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Chih-Hsien Chiu, Wen-Jung Tsai, Chien-Cheng Lin, Ko-Wei Chang, Yu-Wei Yeh, Shun-Yu Chien et al
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Title:
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ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.123, SEC. 3, DAFENG RD., TANZI DIST. |
| TAICHUNG CITY, TAIWAN 427 |
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| SCOTT W. KELLEY |
| 6320 CANOGA AVENUE |
| SUITE 1650 |
| WOODLAND HILLS, CA 91367 |
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