Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/22/2024
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Application #:
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17920014
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Filing Dt:
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10/19/2022
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Publication #:
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Pub Dt:
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06/01/2023
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Inventors:
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Wim Tjibbo TEL, Hermanus Adrianus DILLEN, Marc Jurian KEA, Roy WERKMAN, Weitian KOU
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Title:
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METHOD OF WAFER ALIGNMENT USING AT RESOLUTION METROLOGY ON PRODUCT FEATURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 324 |
| VELDHOVEN, NETHERLANDS 5500 AH |
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| PILLSBURY WINTHROP SHAW PITTMAN, LLP |
| P.O. BOX 10500 |
| MCCLEAN, VA 22102 |
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