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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/26/2024
Application #:
17457048
Filing Dt:
12/01/2021
Publication #:
Pub Dt:
06/01/2023
Inventors:
Ruilong Xie, Tao Li, Tsung-Sheng Kang, Chih-Chao Yang
Title:
VIA PATTERNING FOR INTEGRATED CIRCUITS
Assignment: 1
Reel/Frame:
058252/0174Recorded: 12/01/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/29/2021
Exec Dt:
11/29/2021
Exec Dt:
11/29/2021
Exec Dt:
11/29/2021
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION-PATENT CENTER
1701 NORTH STREET
B256-3
ENDICOTT, NY 13760

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