Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18013656
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Filing Dt:
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12/29/2022
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Publication #:
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Pub Dt:
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06/01/2023
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Inventors:
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Yan HUO, Xufeng TU
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Title:
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SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BUILDING C, NO. 25 XIYONG ROAD, SHAPINGBA DISTRICT |
CHONGQING, CHINA 401331 |
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MUNCY, GEISSLER, OLDS & LOWE, PC |
125 S. ROYAL ST. |
ALEXANDRIA, VA 22314 |
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06/25/2024 12:49 PM
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