Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18058245
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Filing Dt:
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11/22/2022
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Publication #:
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Pub Dt:
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06/08/2023
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Inventors:
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Chun-Huai LI, Chi-Wen CHEN
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Title:
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APPARATUS AND METHOD FOR REPAIRING DEFECT OF SEMICONDUCTOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| A2-A12-8,1F., NO. 1, LIXING 1ST RD. |
| EAST DIST. |
| HSINCHU CITY, TAIWAN 300 |
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| CKC & PARTNERS CO., LLC |
| 12345 LAKE CITY WAY NE, NO. 283 |
| SEATTLE, WA 98125 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO.7, DUSING RD., HSINCHU SCIENCE PARK |
| HSIN-CHU CITY, TAIWAN 300096 |
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| HERMAN PARIS |
| 330 JOHN CARLYLE STREET |
| SUITE 220 |
| ALEXANDRIA, VA 22314 |
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