Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/02/2024
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Application #:
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17615566
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Filing Dt:
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11/30/2021
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Publication #:
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Pub Dt:
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06/15/2023
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Inventor:
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Cheng-Jer YANG
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Title:
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TESTING METHOD FOR PACKAGED CHIP, TESTING SYSTEM FOR PACKAGED CHIP, COMPUTER DEVICE AND STORAGE MEDIUM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| HEFEI, ANHUI, CHINA 230000 |
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| SYNCODA LLC |
| 208 EUPHORIA CIR |
| CARY, NC 27519 |
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09/25/2024 02:39 AM
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