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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/05/2024
Application #:
18167442
Filing Dt:
02/10/2023
Publication #:
Pub Dt:
06/15/2023
Inventors:
Kuei-Ming CHANG, Rei-Jay HSIEH, Cheng-Han WU, Chie-Iuan LIN
Title:
INTEGRATED CIRCUIT STRUCTURE
Assignment: 1
Reel/Frame:
062724/0539Recorded: 02/16/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/23/2017
Exec Dt:
06/23/2017
Exec Dt:
06/23/2017
Exec Dt:
06/23/2017
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD
SUITE 100E
FALLS CHURCH, VA 22042

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