Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17989791
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Filing Dt:
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11/18/2022
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Publication #:
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Pub Dt:
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06/15/2023
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Inventors:
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Dong Jin Kim, Se Woong Cha, Joon Dong Kim, Jin Han Kim, Ji Hun Lee, Yeong Beom Ko
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Title:
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Method of Manufacturing a Package-on-Package Type Semiconductor Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2045 E. INNOVATION CIRCLE |
TEMPE, ARIZONA 85284 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON STREET |
SUITE 3400 |
CHICAGO, IL 60661 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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491 B RIVER VALLEY ROAD |
VALLEY POINT #12/03 |
SINGAPORE, SINGAPORE 248373 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON STREET |
SUITE 3400 |
CHICAGO, IL 60661 |
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06/01/2024 10:47 AM
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