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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18173837
Filing Dt:
02/24/2023
Publication #:
Pub Dt:
06/22/2023
Inventors:
Li Chun LIU, Chun Tang WANG, Chih Hung WANG, Ching Feng LEE, Yu-Lung YEH
Title:
PASSIVATION LAYER FOR A SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
062792/0197Recorded: 02/24/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/16/2021
Exec Dt:
02/16/2021
Exec Dt:
02/16/2021
Exec Dt:
02/08/2021
Exec Dt:
02/08/2021
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HARRITY & HARRITY, LLP
11350 RANDOM HILLS RD.
SUITE 600
FAIRFAX, VA 22030

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