Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17927399
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Filing Dt:
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11/23/2022
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Publication #:
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Pub Dt:
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06/29/2023
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Inventors:
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Yoshiaki Sakaniwa, Toyo Ohashi
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Title:
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MANUFACTURING METHOD FOR INSULATING RESIN CIRCUIT SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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| LOCKE LORD LLP |
| 701 8TH ST NW |
| SUITE 500 |
| WASHINGTON, DC 20001-4360 |
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06/27/2024 11:32 AM
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