Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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06/04/2024
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Application #:
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17983561
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Filing Dt:
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11/09/2022
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Publication #:
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Pub Dt:
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06/29/2023
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Inventors:
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Masahiro Kitamura, Takuroh Kamimura, Junki Hashiba, Takateru Adachi
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Title:
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HEAT DISSIPATION STRUCTURE, MANUFACTURING METHOD FOR HEAT DISSIPATION STRUCTURE, AND ELECTRONIC APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 151 LORONG CHUAN |
| #02-01 NEW TECH PARK |
| SINGAPORE, SINGAPORE 556741 |
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| THOMAS K. SCHERER |
| 1100 LOUISIANA |
| SUITE 4900 |
| HOUSTON, TX 77002 |
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