Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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10/01/2024
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Application #:
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17564137
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Filing Dt:
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12/28/2021
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Publication #:
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Pub Dt:
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06/29/2023
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Inventors:
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Wonjun JUNG, Jasmeet SINGH NARANG, Tyrone HUANG, Christopher KLEMENT, Alan D. SMITH et al
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Title:
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THROUGH-SILICON VIA LAYOUT FOR MULTI-DIE INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 COMMERCE VALLEY DRIVE EAST |
| MARKHAM, CANADA L3T 7X6 |
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| DAVIDSON SHEEHAN LLP |
| 6836 AUSTIN CENTER BLVD |
| SUITE 320 |
| AUSTIN, TX 78731 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2485 AUGUSTINE DRIVE |
| SANTA CLARA, CALIFORNIA 95054 |
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| DAVIDSON SHEEHAN LLP |
| 6836 AUSTIN CENTER BLVD |
| SUITE 320 |
| AUSTIN, TX 78731 |
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09/25/2024 07:59 AM
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