Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18147415
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Filing Dt:
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12/28/2022
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Publication #:
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Pub Dt:
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06/29/2023
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Inventors:
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Daohui LI, Zihao ZHAO, Haiyang CAO, Fang QI, Pin ZENG
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Title:
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PACKAGING STRUCTURE FOR POWER MODULE, PACKAGING METHOD AND ELECTRIC VEHICLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING F, HENGCHUANG INTELLIGENT SCIENCE AND TECHNOLOGY PARK |
| NO. 3963 SUSONG ROAD, ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE |
| HEFEI CITY, ANHUI, CHINA 230601 |
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| SHERIDAN ROSS P.C. |
| 1560 BROADWAY |
| SUITE 1200 |
| DENVER, CO 80202 |
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