Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18009533
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Filing Dt:
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12/09/2022
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Publication #:
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Pub Dt:
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07/06/2023
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Inventors:
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Wilhelmus Gerardus Joseph Gal, Johannes Lambertus Gerardus Maria Venrooij et al
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Title:
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Method and Mould for Encapsulating Electronic Components Mounted on a Carrier
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| RATIO 6 |
| DUIVEN, NETHERLANDS 6921 RW |
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| THE WEBB LAW FIRM |
| 420 FORT DUQUESNE BLVD |
| ONE GATEWAY CENTER SUITE 1200 |
| PITTSBURGH, PA 15222 |
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