Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17703694
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Filing Dt:
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03/24/2022
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Publication #:
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Pub Dt:
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07/06/2023
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Inventors:
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HeeSuk KIM, JeeIn JUNG, SeungJun CHUNG, JeongGon SON, Phillip LEE, Youngpyo KO
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Title:
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CONDUCTIVE POLYMER ADHESIVE AND METHOD OF PREPARING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5 HWARANG-RO 14GIL, SEONGBUK-GU |
SEOUL, KOREA, REPUBLIC OF |
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STUDEBAKER & BRACKETT PC |
8255 GREENSBORO DRIVE |
SUITE 300 |
TYSONS, VA 22102 |
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09/26/2024 07:52 AM
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