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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
17566294
Filing Dt:
12/30/2021
Publication #:
Pub Dt:
07/06/2023
Inventors:
Yan Xun Xue, Long-Ching Wang, Xiaoguang Zeng, Mary Jane R. Alin, Hailin Zhou et al
Title:
SEMICONDUCTOR PACKAGE HAVING MOLD LOCKING FEATURE
Assignment: 1
Reel/Frame:
058510/0724Recorded: 12/30/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/23/2021
Exec Dt:
12/28/2021
Assignee:
100 KING STREET WEST, SUITE # 6000
TORONTO, CANADA ONTARIO M5X 1E2
Correspondent:
CHEN-CHI LIN
1119 QUAIL CREEK CIRCLE
SAN JOSE, CA 95120
Assignment: 2
Reel/Frame:
058972/0889Recorded: 02/10/2022Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/09/2022
Exec Dt:
01/05/2022
Exec Dt:
12/31/2021
Exec Dt:
01/05/2022
Assignee:
100 KING STREET WEST, SUITE # 6000
TORONTO, CANADA ONTARIO M5X 1E2
Correspondent:
CHEN-CHI LIN
1119 QUAIL CREEK CIRCLE
SAN JOSE, CA 95120

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