Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18002107
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Filing Dt:
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12/16/2022
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Publication #:
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Pub Dt:
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07/20/2023
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Inventors:
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Yasuhisa Ishihara, Yuya Hironaka, Katsuyuki Tanaka
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Title:
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SILICONE COMPOSITION AND A THERMALLY CONDUCTIVE SILICONE CURED PRODUCT HAVING HIGH THERMAL CONDUCTIVITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-0005 |
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| MYERS BIGEL, P.A. |
| 4140 PARKLAKE AVENUE |
| SUITE 600 |
| RALEIGH, NC 27612 |
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