Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17661940
|
Filing Dt:
|
05/04/2022
|
|
Publication #:
|
|
Pub Dt:
|
07/20/2023
| | | | |
|
Inventors:
|
Chia-Shen Cheng, Chia-Lun Chang, Hao-Jan Pei, Hsiu-Jen Lin, Ching-Hua Hsieh
|
|
Title:
|
LASER DRILLING PROCESS FOR INTEGRATED CIRCUIT PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| SLATER MATSIL, LLP |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
|
|
Search Results as of:
05/27/2024 09:44 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
