Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17579038
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Filing Dt:
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01/19/2022
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Publication #:
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Pub Dt:
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07/20/2023
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Inventors:
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Changhan Hobie YUN, Nosun PARK, Daniel Daeik KIM, Paragkumar Ajaybhai THADESAR et al
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Title:
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DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR PASSIVE AND DEVICE INTEGRATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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| SEYFARTH SHAW LLP |
| 2029 CENTURY PARK EAST, SUITE 3500 |
| LOS ANGELES, CA 90067 |
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