Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/21/2024
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Application #:
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18011193
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Filing Dt:
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12/19/2022
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Publication #:
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Pub Dt:
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07/27/2023
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Inventors:
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Haonan WANG, Mingjie CAO, Yan SANG, Hongbing HOU, Wei DENG, Yunxiao MEI, Dayue JIN et al
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Title:
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Anti-PID Encapsulation Adhesive Film, Photovoltaic Module, and Photovoltaic Module Manufacturing Method
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.8 FIRST STREET JINBEI SUB-DISTRICT, LIN'AN |
HANGZHOU, ZHEJIANG, CHINA 311300 |
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GANG YU SAMSON G.YU |
ACIP INTERNATIONAL, INC. |
419 10TH ST, #100 |
SF, CA 94103 |
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06/14/2024 09:12 AM
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