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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18099290
Filing Dt:
01/20/2023
Publication #:
Pub Dt:
07/27/2023
Inventors:
Christian Fachmann, Barbara Angela Glanzer, Andreas Riegler
Title:
SEMICONDUCTOR PACKAGE INCLUDING A CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
062764/0939Recorded: 02/22/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/01/2023
Exec Dt:
02/01/2023
Exec Dt:
02/03/2023
Assignee:
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondent:
MURPHY, BILAK & HOMILLER, PLLC
PO BOX 1959
CARY, NC 27572-1959

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