Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18099290
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Filing Dt:
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01/20/2023
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Publication #:
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Pub Dt:
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07/27/2023
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Inventors:
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Christian Fachmann, Barbara Angela Glanzer, Andreas Riegler
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING A CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SIEMENSSTRASSE 2 |
| VILLACH, AUSTRIA 9500 |
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| MURPHY, BILAK & HOMILLER, PLLC |
| PO BOX 1959 |
| CARY, NC 27572-1959 |
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06/26/2024 06:36 PM
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