Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17870932
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Filing Dt:
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07/22/2022
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Publication #:
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Pub Dt:
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08/03/2023
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Inventors:
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Cheng Li, Yikai Yuan, Xiangxuan Tan, Nianbin Cheng, Lifang Liang, Honggui Zhan
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Title:
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DISCRETE COMPONENT, POWER MODULE AND HEAT SINK SYSTEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 18 SOUTH HUABAO ROAD, CHANCHENG DISTRICT |
FOSHAN, CHINA 528000 |
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BOND SCHOENECK & KING |
ONE LINCOLN CENTER |
GEORGE R. MCGUIRE |
SYRACUSE, NY 13202 |
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06/21/2024 05:31 PM
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