Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17962185
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Filing Dt:
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10/07/2022
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Publication #:
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Pub Dt:
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08/17/2023
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Inventors:
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Hsiao-Yun CHEN, Chi-Hung HUANG, Cheng-Jyi CHANG, Sheng Chieh CHANG, Yao-Tsung HUANG
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Title:
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SEMICONDUCTOR PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING 1ST RD. |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30078 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C. |
| 1100 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20005 |
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05/10/2024 01:52 AM
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