Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18167063
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Filing Dt:
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02/09/2023
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Publication #:
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Pub Dt:
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08/17/2023
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Inventors:
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Jau-Han Ke, Chun-Chieh Wang, Tsung-Ting Chen, Yu-Ming Lin, Cheng-Wen Hsieh, Wen-Neng Liao
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Title:
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THERMAL MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F., NO.88, SEC. 1, XINTAI 5TH RD., XIZHI DIST., |
| NEW TAIPEI CITY, TAIWAN 221 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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06/17/2024 08:27 AM
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