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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/11/2025
Application #:
18014614
Filing Dt:
01/05/2023
Publication #:
Pub Dt:
08/31/2023
Inventors:
Sung Je LEE, Seong Hun KIM, Hae Jun LEE
Title:
VAPOR INJECTION MODULE AND HEAT PUMP SYSTEM USING SAME
Assignment: 1
Reel/Frame:
063582/0614Recorded: 05/09/2023Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/08/2023
Exec Dt:
05/08/2023
Assignee:
95 SINILSEO-RO, DAEDEOK-GU
DAEJEON, KOREA, REPUBLIC OF 34325
Correspondent:
NORTON ROSE FULBRIGHT US LLP
1301 AVENUE OF THE AMERICAS
JAMES R. CRAWFORD
NEW YORK, NY 10019

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