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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18154978
Filing Dt:
01/16/2023
Publication #:
20230275128
Pub Dt:
08/31/2023
Inventors:
Junyoung KWON, Sangwoo KIM, Kyung-Eun BYUN, Minsu SEOL, Minseok SHIN, Pin ZHAO et al
Title:
SEMICONDUCTOR DEVICE COMPRISING TWO-DIMENSIONAL MATERIAL AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
062418/0102Recorded: 01/19/2023Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KWON, JUNYOUNG
Exec Dt:
07/14/2022
BYUN, KYUNG-EUN
Exec Dt:
07/14/2022
SEOL, MINSU
Exec Dt:
07/14/2022
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195
Assignment: 2
Reel/Frame:
062418/0295Recorded: 01/19/2023Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KIM, SANGWOO
Exec Dt:
07/18/2022
SHIN, MINSEOK
Exec Dt:
07/18/2022
ZHAO, PIN
Exec Dt:
07/18/2022
KIM, TAEHYEONG
Exec Dt:
07/18/2022
JUNG, JAEHWAN
Exec Dt:
07/18/2022
Assignee:
RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
2066, SEOBU-RO, JANGAN-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16419
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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