Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18164922
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Filing Dt:
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02/06/2023
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Publication #:
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Pub Dt:
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08/31/2023
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Inventors:
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Wan-Lin HSU, Kun-Cheng LEE, Jui-Lin YANG, Hsin-Chih CHOU, Juei-Chi CHANG
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Title:
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ELECTRONIC DEVICE ASSEMBLY, EXPANSION COMPONENT THEREOF, AND HEAT DISSIPATION MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7F., NO. 209, NANYANG ST., XIZHI DIST. |
| NEW TAIPEI CITY, TAIWAN |
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| MCCLURE, QUALEY & RODACK LLP |
| 280 INTERSTATE NORTH CIRCLE |
| SUITE 530 |
| ATLANTA, GA 30339 |
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