Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17685871
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Filing Dt:
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03/03/2022
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Publication #:
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Pub Dt:
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09/07/2023
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Inventors:
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Thomas Wagner, Abdallah Bacha, Vishnu Prasad, Mohan Prashanth Javare Gowda et al
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Title:
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STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| MANJULA VARIYAM |
| PATENT CAPITAL GROUP |
| 4524 BRIAR HOLLOW DRIVE |
| PLANO, TX 75093 |
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