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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/23/2024
Application #:
18318208
Filing Dt:
05/16/2023
Publication #:
Pub Dt:
09/07/2023
Inventors:
Ju-Hsien LIN, Jung-Tao CHUNG, Shu-Hsiao TSAI, Hsi-Tsung LIN, Chen-An HSIEH, Yi-Han CHEN et al
Title:
SEMICONDUCTOR STRUCTURE
Assignment: 1
Reel/Frame:
063655/0538Recorded: 05/16/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Exec Dt:
01/08/2021
Assignee:
NO. 69, KEJI 7TH RD., GUISHAN DIST.
TAOYUAN CITY, TAIWAN 33383
Correspondent:
MCCLURE, QUALEY & RODACK LLP
280 INTERSTATE NORTH CIRCLE
SUITE 530
ATLANTA, GA 30339

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