Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18011500
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Filing Dt:
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12/19/2022
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Publication #:
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Pub Dt:
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09/14/2023
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Inventors:
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Leqi Li, Yelei Xie, Jian Pang, Tuobei Sun
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Title:
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INTERPOSER AND CHIP PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ZTE INDUSTRIAL PARK, LIUXIAN AVENUE |
| XILI STREET, NANSHAN DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518055 |
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| JAMES H. MORRIS |
| WOLF GREENFIELD & SACKS, PC |
| 600 ATLANTIC AVENUE |
| BOSTON, MA 02210 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME IS SANECHIPS TECHNOLOGY CO., LTD. PREVIOUSLY RECORDED AT REEL: 062152 FRAME: 0411. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| ZTE INDUSTRIAL PARK, LIUXIAN AVENUE |
| XILI STREET, NANSHAN DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518055 |
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| JAMES H. MORRIS |
| WOLF GREENFIELD & SACKS, PC |
| 600 ATLANTIC AVENUE |
| BOSTON, MA 02210 |
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09/22/2024 10:02 PM
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