Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/20/2024
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Application #:
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17699389
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Filing Dt:
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03/21/2022
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Publication #:
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Pub Dt:
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09/21/2023
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Inventors:
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Feng ZHOU, Ercan Dede, Hiroshi Ukegawa
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Title:
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POWER DEVICE ASSEMBLIES HAVING EMBEDDED PCBS AND ENHANCED COOLING AND METHODS OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, TOYOTA-CHO |
| TOYOTA-SHI, AICHI-KEN, JAPAN 471-8571 |
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| 500-1 MINAMIYAMA |
| KOMENOKICHO, NISSHIN CITY, JAPAN 470-0111 |
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| 1-1, SHOWA-CHO |
| KARIYA, AICHI, JAPAN 448-8664 |
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| DINSMORE & SHOHL LLP |
| 255 EAST FIFTH STREET |
| SUITE 1900 |
| CINCINNATI, OH 45202 |
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