Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17993899
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Filing Dt:
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11/24/2022
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Publication #:
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Pub Dt:
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09/28/2023
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Inventors:
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Feng Yin, Hui Li
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Title:
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CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Manufacturing Method Thereof
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BAITA INDUSTRIAL CLUSTER, ECONOMIC DEVELOPMENT ZONE |
BAITA TOWN, XIANJU COUNTY |
TAIZHOU CITY, CHINA 317300 |
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ANNA TSANG |
NO.164-10, LANE 162, JINGYE 3RD RD. |
TAIPEI, 10466 TAIWAN |
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06/16/2024 07:48 PM
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