Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18015300
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Filing Dt:
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01/09/2023
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Publication #:
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Pub Dt:
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09/28/2023
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Inventors:
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Yosuke MURAKAMI, Kenji HOSOI, Hiroshi EGUCHI, Yuki HAGIWARA, Masaki YAMADA et al
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Title:
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Polybenzoxazole, Polyamide, Polyamide Solution, Insulating Material for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Equipment, Insulating Material for Producing High-Frequency Electronic Component, Method for Producing Polyamide, Method for Producing Polybenzoxazole, Method for Producing Insulating Material for High-Frequency Electronic Component, and Diamine or Salt Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5253, OAZA OKIUBE |
| UBE-SHI, YAMAGUCHI, JAPAN 755-0001 |
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| CROWELL & MORING LLP |
| P.O. BOX 14300 |
| WASHINGTON, DC 20044-4300 |
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