Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18022809
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Filing Dt:
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02/23/2023
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Publication #:
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Pub Dt:
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09/28/2023
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Inventors:
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Yun Seok BAE, Hyun Je LEE, Kyun Ha BAN, Young Sub JIN
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Title:
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Thermoplastic Resin Composition and Molded Product Using Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 300, OLYMPIC-RO SONGPA-GU |
| SEOUL, KOREA, REPUBLIC OF 05551 |
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| ADDITON, PENDLETON & WITHERSPOON, P.A. |
| P.O. BOX 567 |
| MONROE, NC 28111 |
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