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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18018932
Filing Dt:
01/31/2023
Publication #:
Pub Dt:
09/28/2023
Inventors:
Kalpendu Shastri, Soham Pathak, Bipin D. Dama, Sriram Tyagarajan, Anujit Shastri et al
Title:
HIGH DENSITY OPTICAL/ELECTRICAL INTERCONNECTION ARRANGEMENT WITH HIGH THERMAL EFFICIENCY
Assignment: 1
Reel/Frame:
062544/0960Recorded: 01/31/2023Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/23/2023
Exec Dt:
01/23/2023
Exec Dt:
01/12/2023
Exec Dt:
01/23/2023
Exec Dt:
01/20/2023
Exec Dt:
01/23/2023
Assignee:
7540 WINDSOR DRIVE
SUITE 306
ALLENTOWN, PENNSYLVANIA 18106
Correspondent:
WENDY W. KOBA
PO BOX 556
SPRINGTOWN, PA 18081

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