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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18171015
Filing Dt:
02/17/2023
Publication #:
Pub Dt:
09/28/2023
Inventors:
Tsuyoshi TAKEDA, Daisuke HARA, Iichiro TSUCHIKURA, Hiroshi NAKAJO
Title:
Substrate Processing Apparatus, Electrode Structure and Method of Manufacturing Semiconductor Device
Assignment: 1
Reel/Frame:
063304/0320Recorded: 04/12/2023Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/02/2023
Exec Dt:
02/01/2023
Exec Dt:
02/15/2023
Exec Dt:
02/01/2023
Assignee:
3-4, KANDAKAJI-CHO, CHIYODA-KU
TOKYO, JAPAN 1010045
Correspondent:
EDELL, SHAPIRO & FINNAN, LLC
9801 WASHINGTONIAN BOULEVARD
SUITE 750
GAITHERSBURG, MD 20878

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