Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17701686
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Filing Dt:
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03/23/2022
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Publication #:
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Pub Dt:
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09/28/2023
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Inventors:
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Yung-Hsiang Chen, Yun-Chou Wei, Ke-Fang Hsu, Ching-Yi Hsu, Yen-Shih Ho
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Title:
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STRUCTURES AND METHODS OF TRANSFERRING DIES AND DIE BONDED STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 123, PARK AVE-3RD, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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