Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18184436
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Filing Dt:
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03/15/2023
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Publication #:
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Pub Dt:
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09/28/2023
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Inventors:
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David GANI, Hui-Tzu Wang
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Title:
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SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SUITE 1606-1612, 16/F, TOWER 1, THE GATEWAY, 25 CANTON ROAD, TSIM SHA TSUI |
| KOWLOON, HONG KONG 999077 |
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| TESSA DEJKUNCHORN |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEED IP LAW GROUP LLP |
| SEATTLE, WA 98104 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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| TESSA DEJKUNCHORN |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEED IP LAW GROUP LLP |
| SEATTLE, WA 98104 |
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