Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17854489
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Filing Dt:
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06/30/2022
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Publication #:
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Pub Dt:
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10/05/2023
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Inventors:
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Ho-Ming TONG, Wei YEN, Chao-Chun LU
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Title:
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COMPOSITE SEMICONDUCTOR WAFER/CHIP FOR ADVANCED ICS AND ADVANCED IC PACKAGES AND THE MANUFACTURE METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2F., NO. 22, LN. 35, JIHU RD., NEIHU DIST. |
TAIPEI CITY, TAIWAN 114754 |
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NO. 6, TECHNOLOGY ROAD 5 |
HSINCHU, TAIWAN 300 |
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BIRCH, STEWART, KOLASCH & BIRCH, LLP |
8110 GATEHOUSE ROAD, SUITE 100E |
FALLS CHURCH, VA 22042 |
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