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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17709367
Filing Dt:
03/30/2022
Publication #:
20230317653
Pub Dt:
10/05/2023
Inventors:
Xiaoxuan SUN, Dingying David XU, Hongxia FENG, Amey Anant APTE, Sairam AGRAHARAM et al
Title:
HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS ON BOTH SIDES OF THE DIE
Assignment: 1
Reel/Frame:
064250/0277Recorded: 07/13/2023Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
FENG, HONGXIA
Exec Dt:
03/30/2022
SUN, XIAOXUAN
Exec Dt:
03/24/2022
APTE, AMEY ANANT
Exec Dt:
03/25/2022
XU, DINGYING DAVID
Exec Dt:
03/24/2022
AGRAHARAM, SAIRAM
Exec Dt:
03/29/2022
DUAN, GANG
Exec Dt:
03/28/2022
DANI, ASHAY
Exec Dt:
03/30/2022
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
JUSTIN K. BRASK
1211 SW 5TH AVENUE, STE. 1900
PORTLAND, OR 97204

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