Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17706408
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Filing Dt:
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03/28/2022
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Publication #:
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Pub Dt:
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10/12/2023
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Inventors:
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Shihsheng Chang, Yun Han, Ya-Ming Chen, Andrew Metz, Minjoon Park
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Title:
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TECHNOLOGIES FOR HIGH ASPECT RATIO CARBON ETCHING WITH INSERTED CHARGE DISSIPATION LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AKASAKA BIZ TOWER |
| 3-1 AKASAKA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN 107-6325 |
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| TOKYO ELECTRON U.S. HOLDINGS, INC. |
| 2400 GROVE BLVD. |
| AUSTIN, TX 78741 |
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