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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17741872
Filing Dt:
05/11/2022
Publication #:
Pub Dt:
10/12/2023
Inventors:
Yung-Hui WANG, CHUNG-HSIUNG HO, CHI-HSUEH LI
Title:
PACKAGED COMPONENT WITH COMPOSITE PIN STRUCTURE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
060003/0466Recorded: 05/12/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/10/2022
Exec Dt:
05/10/2022
Exec Dt:
05/10/2022
Assignee:
NO. 24, KANG-SHAN NORTH RD., GANGSHAN DIST.
KAOHSIUNG CITY, TAIWAN
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD, SUITE 100 E
FALLS CHURCH, VA 22042

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