Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17715056
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Filing Dt:
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04/07/2022
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Publication #:
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Pub Dt:
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10/12/2023
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Inventor:
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Chun-Hsia Chen
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Title:
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ELECTRIC CONTACT STRUCTURE FOR THREE-DIMENSIONAL CHIP PACKAGE MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.18, BEIYUAN RD., ZHONGLI DIST. |
| TAOYUAN CITY, TAIWAN |
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| CHUN-HSIA CHEN |
| P.O. BOX 90-3 |
| TAIPEI, 10699 TAIWAN |
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06/21/2024 03:26 PM
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