Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17714416
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Filing Dt:
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04/06/2022
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Publication #:
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Pub Dt:
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10/12/2023
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Inventors:
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Chia-Kuei Hsu, Ming-Chih Yew, Li-Ling Liao, Po-Yao Lin, Shin-Puu Jeng
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Title:
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MICROBUMP UNDERFILL FILLET REMOVAL IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN 6 ROAD |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN ROC 30077 |
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| THE MARBURY LAW GROUP, PLLC |
| 11800 SUNRISE VALLEY DRIVE |
| 15TH FLOOR |
| RESTON, VA 20191 |
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