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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18296433
Filing Dt:
04/06/2023
Publication #:
Pub Dt:
10/12/2023
Inventors:
Wei Gong, Chunlin Zhu, Ke Jiang
Title:
PACKAGE STRUCTURE FOR POWER SEMICONDUCTOR DEVICES WITH IMPROVED PARASITIC PARAMETERS
Assignment: 1
Reel/Frame:
063240/0480Recorded: 04/06/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/25/2022
Exec Dt:
04/25/2022
Exec Dt:
04/25/2022
Assignee:
ROOM 201, NO. 458 JUMEN ROAD
HUANGPU DISTRICT
SHANGHAI, CHINA 200025
Correspondent:
RUGGIERO MCALLISTER & MCMAHON LLC
ONE LANDMARK SQUARE
18TH FLOOR
STAMFORD, CT 06901
Assignment: 2
Reel/Frame:
063240/0672Recorded: 04/06/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/25/2022
Exec Dt:
04/25/2022
Exec Dt:
04/25/2022
Assignee:
JONKERBOSPLEIN 52
NIJMEGEN, NETHERLANDS 6534AB
Correspondent:
RUGGIERO MCALLISTER & MCMAHON LLC
ONE LANDMARK SQUARE
18TH FLOOR
STAMFORD, CT 06901

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