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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18341369
Filing Dt:
06/26/2023
Publication #:
20230335545
Pub Dt:
10/19/2023
Inventors:
Kam-Tou SIO, Chih-Liang CHEN, Hui-Ting YANG, Shun Li CHEN, Ko-Bin KAO, Chih-Ming LAI et al
Title:
METHOD OF MANUFACTURING CONDUCTORS FOR SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
064061/0083Recorded: 06/26/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SIO, KAM-TOU
Exec Dt:
07/13/2017
CHEN, CHIH-LIANG
Exec Dt:
07/13/2017
LAI, CHIH-MING
Exec Dt:
07/24/2017
YOUNG, CHALRES CHEW-YUEN
Exec Dt:
07/13/2017
YANG, HUI-TING
Exec Dt:
07/13/2017
KAO, KO-BIN
Exec Dt:
08/03/2017
LIN, RU-GUN
Exec Dt:
07/15/2017
CHEN, SHUN LI
Exec Dt:
07/13/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAUPTMAN HAM, LLP
2318 MILL ROAD, SUITE 1400
ALEXANDRIA, VA 22314

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