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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/17/2024
Application #:
18304310
Filing Dt:
04/20/2023
Publication #:
Pub Dt:
10/19/2023
Inventors:
Jialing Li CHEN, Sameer Vermani, Lin Yang, Bin Tian
Title:
PHYSICAL LAYER PREAMBLE DESIGN FOR SPECIAL PACKET TYPES
Assignment: 1
Reel/Frame:
064180/0543Recorded: 07/07/2023Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/13/2021
Exec Dt:
03/18/2021
Exec Dt:
01/20/2021
Exec Dt:
01/13/2021
Assignee:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121
Correspondent:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CA 92121

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