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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17726992
Filing Dt:
04/22/2022
Publication #:
Pub Dt:
10/26/2023
Inventors:
Shihsheng Chang, Andrew Metz, Yun Han, Minjoon Park, Kai-Hung Yu, Eric Chih-Fang Liu
Title:
Method For Improving Etch Rate And Critical Dimension Uniformity When Etching High Aspect Ratio Features Within A Hard Mask Layer
Assignment: 1
Reel/Frame:
059680/0197Recorded: 04/22/2022Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/30/2022
Exec Dt:
03/30/2022
Exec Dt:
04/14/2022
Exec Dt:
03/31/2022
Exec Dt:
04/20/2022
Exec Dt:
04/11/2022
Assignee:
3-1 AKASAKA 5-CHOME, MINATO-KU
TOKYO, JAPAN 107-6325
Correspondent:
TEL-EGAN, ENDERS & HUSTON LLP.
1101 S CAPITAL OF TEXAS HWY
BLDG. C, SUITE 200
AUSTIN, TX 78746

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